The White House has unveiled a $100 billion public-private partnership to build 20 new semiconductor fabrication facilities across the United States by 2030, aiming to reduce dependence on Asian chip manufacturing.
Initiative Details
- $100 billion total investment (government + private)
- 20 new fabs across 15 states
- 500,000 direct and indirect jobs
- Target: 25% global chip production by 2030 (up from 12%)
Intel, TSMC, Samsung, and Micron have all committed to major US expansions. The initiative includes workforce development grants for community colleges near fab sites.
